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71342SA20J is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 32KBIT PARALLEL 52PLCC. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 71342SA20J is a high-speed, asynchronous dual-port static random access memory (SRAM) device. It features a storage capacity of 32 kbit organized as 4K x 8 bits. The component supports parallel interface communication with an access time of 20 ns. It operates within a supply voltage range of 4.5 V to 5.5 V and draws a maximum power supply current of 240 mA. The device is housed in a 64-pin Thin Quad Flat Package (TQFP) suitable for surface mount technology. It functions within a commercial temperature range from 0°C to +70°C.
Verify component authenticity through authorized distributors or direct manufacturer channels due to potential availability constraints. Confirm package integrity and moisture sensitivity handling requirements prior to assembly. Review official datasheets for specific electrical characteristics and mechanical dimensions to ensure compatibility with existing design parameters.
Select this component when dual-port functionality with integrated semaphore arbitration is required for asynchronous memory applications. Ensure the system design accommodates the 64-pin TQFP package dimensions and thermal dissipation needs. Verify that the operating environment remains within the specified commercial temperature limits and voltage tolerances for reliable performance.
This part belongs to the Renesas 71342 series of dual-port SRAMs, designed for applications needing fast, independent access from multiple masters. The series typically offers various speed grades and package options to suit different system requirements while maintaining consistent functional architecture across the family.
Consult official Renesas documentation for confirmed substitute part numbers. Cross-reference specifications such as access time, pinout compatibility, and package dimensions before considering alternatives.
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