71V35761S166BGG8

Memory IC Overview

The IDT71V35761S166BGG8 is a 4.5 Mbit synchronous single data rate (SDR) static random-access memory (SRAM) integrated circuit manufactured by Renesas Electronics Corporation. The device features a parallel interface with a memory organization of 128K words by 36 bits. It operates at a maximum clock frequency of 166 MHz with an access time of 3.5 ns. The component requires a supply voltage range of 3.135 V to 3.465 V and is housed in a 119-pin plastic ball grid array (PBGA) package measuring 14 mm by 22 mm.

Memory IC Feature Summary

• Supports high-speed parallel data transfer via a synchronous SDR interface architecture.
• Utilizes pipelined burst capabilities to optimize bus turnaround efficiency between read and write operations.
• Provides reliable volatile data storage within specified industrial temperature ranges.

Memory IC Applications

• High-performance networking equipment requiring fast buffer memory
• Telecommunications infrastructure systems
• Industrial automation control units

Memory IC Procurement Notes

This specific part number is officially listed as obsolete or end-of-life by the manufacturer. Verification of current availability should focus on authorized distributors offering remaining new old stock or approved replacement alternatives. Confirm that any sourced units match the original RoHS non-compliant status and lead-free specifications documented in the official product change notices.

Memory IC Selection Notes

Engineers selecting this component must account for its discontinued manufacturing status when designing long-term production systems. The 119-PBGA package requires specific surface-mount assembly processes compatible with the 14x22 mm footprint. Designers should verify that the 3.3 V I/O levels and 3.5 ns access speed meet the timing requirements of the target system bus before finalizing the bill of materials.

Memory IC Part Context

The 71V35761S series represents a family of high-density synchronous SRAM devices designed for demanding applications. This specific variant belongs to the 166 MHz performance tier, offering a balance between capacity and speed. The PBGA packaging option provides thermal efficiency and electrical performance suitable for dense printed circuit board layouts in professional electronic equipment.

Memory IC Replacement Considerations

Official substitutes include the IDT71V35761SA166BGG8 and IDT71V35761S200BGGI8. These parts share similar architectural characteristics but may differ in operating temperature ranges or specific suffix designations. Verify pin compatibility and electrical parameters against the original datasheet before implementation.