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74HC366FPEL-E is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC BUFFER INVERT 6V. Review the specifications below when checking this part for your BOM.
The 74HC366FPEL-E is a hex bus driver manufactured by Renesas Electronics Corporation, belonging to the 74HC series of high-speed CMOS logic devices. It features six non-inverting buffers with three-state outputs, designed for high-speed operation and wide operating voltage ranges. The component is classified as an integrated circuit within the logic category, specifically functioning as a bus driver. It supports fanout capabilities suitable for driving multiple loads and maintains low input current characteristics typical of CMOS technology.
Verify the specific suffix FPEL-E against official Renesas documentation to confirm package type and tape-and-reel specifications. Ensure compatibility with RoHS directives if required by your manufacturing standards. Cross-reference the manufacturer part number with authorized distributors to confirm current availability and lifecycle status before finalizing procurement plans.
Select this component when a hex non-inverting buffer with three-state control is required for bus architectures. Consider the 74HC series speed and voltage characteristics relative to system requirements. Evaluate pin compatibility and package dimensions against existing PCB layouts. Compare against similar hex bus drivers if alternative supply sources are necessary.
This device is part of the broader 74HC family of high-speed CMOS logic ICs produced by Renesas Electronics. The 74HC series is widely recognized for its compatibility with standard TTL logic levels while offering improved speed and lower power consumption compared to older HC technologies. The 74HC366 variant specifically addresses applications requiring buffered and tri-stated signals.
Compatible substitutes include other hex bus drivers with three-state outputs from the same logic family. Verify pin-to-pin compatibility and electrical specifications such as propagation delay and output current drive strength. Check for equivalent package types to ensure mechanical fit without redesigning the footprint.
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