7V-12.500MAAV-T

Crystals Overview

The 7V-12.500MAAV-T is a surface-mount crystal oscillator manufactured by TXC Corporation, designed for precision timing applications. It operates at a fundamental frequency of 12.500 MHz with a load capacitance of 8 pF and a frequency tolerance of ±30 ppm. The component features an SMD/SMT package in the 7V series, measuring 3.2 mm x 2.5 mm. It supports a standard operating temperature range from -20°C to +70°C and utilizes a reel packaging format.

Crystals Feature Summary

• Provides stable clock signals for digital circuits
• Compact surface-mount design for automated assembly
• Standardized footprint compatible with common PCB layouts

Crystals Applications

• Microcontroller clock sources
• Communication interface timing
• Digital signal processing systems

Crystals Procurement Notes

Verify the specific suffix 'AAV' against the manufacturer's current datasheet to confirm exact electrical parameters and mechanical dimensions. Ensure compatibility with the target circuit's load capacitance requirements. Check for RoHS compliance status as indicated in official documentation before integration into production environments.

Crystals Selection Notes

Select this component when a 12.500 MHz reference is required within the commercial temperature range. Consider the 8 pF load capacitance requirement for proper oscillator circuit tuning. Evaluate the 30 ppm tolerance against system jitter specifications. Confirm that the 3.2x2.5 mm package fits the available board space constraints.

Crystals Part Context

This part belongs to the 7V series of crystals from TXC Corporation, which are characterized by their small form factor and suitability for high-volume surface-mount manufacturing processes. The series offers various frequency options tailored for general-purpose timing needs in consumer and industrial electronics.

Crystals Replacement Considerations

Consult the manufacturer's cross-reference guide for direct substitutes. Verify equivalent frequency, load capacitance, tolerance, and package dimensions when evaluating alternative components.