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857-028-458-108 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FML 28POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 857-028-458-108 is a standard card edge connector receptacle designed for high-temperature applications. It features 28 positions with a single row configuration and a pitch of 3.96 mm (0.156 inches). The housing is constructed from black polyphenylene sulfide, supporting a board thickness of 1.57 mm. Contact plating utilizes tin finish on copper alloy terminals, rated for 5 A current. The component employs wire wrap termination and is intended for vertical panel mount installation.
Verify the specific ordering suffix to confirm terminal plating type, as variations exist within the series. Confirm that the target application supports wire wrap termination processes rather than surface mount or through-hole soldering. Ensure the PCB design accommodates the specified 1.57 mm board thickness and 3.96 mm pitch constraints for proper mechanical fit.
Select this component when a single-row card edge interface is required with vertical orientation. The tin-plated contacts offer cost-effective conductivity suitable for general industrial environments. Verify that the operating temperature range aligns with the material specifications of the polyphenylene sulfide housing for reliable performance under thermal stress.
This part belongs to the EDAC 857 series of high-temperature card edge connectors. The series provides various position counts while maintaining consistent 3.96 mm pitch dimensions. The 857 series is engineered for durability in demanding electronic assemblies where standard connectors may fail due to thermal or mechanical stress.
Public confirmed substitute part numbers are not available in the provided documentation. Cross-reference with other EDAC 857 series variants only if pin count and termination method requirements can be adjusted accordingly.
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