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98417-S61-30ULF is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is CONN HEADER R/A 30POS 2MM. Review the specifications below when checking this part for your BOM.
The Amphenol ICC (FCI) 98417-S61-30ULF is a Minitek series board-to-board header connector. It features 30 positions arranged in a dual-row configuration with a 2 mm pitch and matching row spacing. The component utilizes right-angle through-hole solder termination with male pin contacts. Gold plating ensures reliable conductivity, while the cream-colored thermoplastic insulator provides shrouding. Rated for 2 A current at 200 V AC/DC, it operates within a temperature range of -40°C to +125°C.
Verify the specific suffix 'ULF' against official datasheets to confirm RoHS compliance status and material specifications. Ensure the ordering code matches the required 30-position count and right-angle orientation. Confirm that the gold contact plating meets the intended application's durability requirements before finalizing procurement.
Select this component when a 2 mm pitch dual-row header is required for right-angle board stacking. Verify that the 2 A current rating and 200 V voltage limit align with circuit demands. Consider the operating temperature range and mechanical locking features if vibration resistance is necessary for the target assembly environment.
This part belongs to the Minitek family of high-density connectors designed for compact electronic applications. The series offers various position counts and termination styles to support diverse board-to-board connectivity needs. Amphenol FCI engineers these components to meet rigorous industrial standards for reliability and performance in demanding environments.
Compatible substitutes include other 30-position, 2 mm pitch dual-row headers from the same manufacturer. Verify that alternative parts maintain identical right-angle orientation and through-hole termination methods. Ensure mating dimensions and shrouding configurations match to guarantee proper physical integration.
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