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A-SL127-EG-G13D is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is PIN HEADER. Review the specifications below when checking this part for your BOM.
The A-SL127-EG-G13D is a single-row through-hole socket connector manufactured by Assmann WSW Components. It features 13 positions with a 1.27mm (0.050 inch) pitch, designed for surface mount or vertical insertion applications. The contacts are gold-plated to ensure reliable signal transmission and corrosion resistance. Constructed with thermoplastic housing, this component provides stable mechanical support for integrated circuits or pin headers in compact electronic assemblies.
Verify the specific suffix 'G13D' against the manufacturer's current datasheet to confirm plating thickness and housing material specifications. Ensure compatibility with standard 1.27mm pitch pin headers. Check RoHS compliance status for your region. Confirm lead time requirements as distribution availability varies. Validate that the single-row design meets your board layout constraints before finalizing procurement orders.
Select this component when a low-profile, single-row socket is required for 13-pin connections. The 1.27mm pitch suits dense circuit boards where space is limited compared to 2.54mm standards. Gold plating is preferred for environments requiring high reliability. Consider mounting orientation and panel cutout dimensions during mechanical integration planning.
This part belongs to Assmann WSW's standard connector portfolio, focusing on precision interconnect solutions. The model number indicates a 13-position variant within the SL series. It complements other components in the same pitch family, allowing for mixed-row configurations in complex assembly designs while maintaining consistent electrical characteristics across the product line.
Direct substitutes must match the 13-position count, 1.27mm pitch, and single-row format. Verify identical mounting style and contact plating specifications. Cross-reference with other manufacturers offering equivalent DIP sockets. Ensure housing material and thermal ratings align with existing system requirements to maintain performance integrity.
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