A-SL200-EG-G22MR1

Headers, Male Pins Overview

The A-SL200-EG-G22MR1 is a surface mount header connector from the ASSMANN WSW A-SL200 series. It features 22 positions with a 2.00mm (0.079 inch) pitch. The connector utilizes gold-plated brass contacts housed in a PBT insulator. Designed for board-to-board applications, it supports a maximum voltage of 125V and a current rating of 1A. The operating temperature range spans from -40°C to 105°C.

Headers, Male Pins Feature Summary

• Surface mount termination method for automated PCB assembly
• Gold-plated brass contacts ensure reliable signal transmission
• PBT housing material provides thermal stability

Headers, Male Pins Applications

• Board-to-board interconnections
• Electronic module integration
• Consumer electronics assemblies

Headers, Male Pins Procurement Notes

Verify the specific suffix MR1 confirms the surface mount configuration and pin count. Ensure compatibility with standard reflow soldering profiles. Confirm that the 22-position layout matches the target footprint requirements. Check for any RoHS compliance documentation if required by the manufacturing process.

Headers, Male Pins Selection Notes

Select this component when a low-profile surface mount header is required for dense circuit layouts. The 2mm pitch offers a balance between pin density and spacing. Consider the 1A current rating for power distribution needs within the specified temperature range. Verify mechanical clearance for the mating connector height.

Headers, Male Pins Part Context

This part belongs to the A-SL200 series, which includes various single and double row headers. The series offers multiple configurations including through-hole and surface mount options. The EG designation typically indicates a specific housing style within the product line. This model represents a mid-density solution for compact electronic designs.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 22-position count, 2mm pitch, and surface mount termination. Verify identical contact plating and housing material specifications. Cross-reference with other manufacturers offering similar SMT header arrays. Ensure mechanical dimensions align with existing PCB footprints.