A-SL200-EG-G24MR1

Headers, Male Pins Overview

The A-SL200-EG-G24MR1 is a surface mount pin header from the ASSMANN WSW A-SL200 series. It features 24 contacts with a 2.00 mm pitch and a single row configuration. The connector utilizes gold-plated brass terminals housed in a PBT insulator, rated for 125V and 1A current. Designed for board-to-board applications, it operates within a temperature range of -40°C to 105°C.

Headers, Male Pins Feature Summary

• Surface mount termination method for automated PCB assembly
• Gold-plated brass contacts ensure reliable conductivity
• PBT housing material provides thermal stability

Headers, Male Pins Applications

• Board-to-board interconnections
• Electronic module integration
• Consumer electronics assemblies

Headers, Male Pins Procurement Notes

Verify that the specific suffix 'MR1' corresponds to the required surface mount footprint and orientation. Confirm compatibility with standard reflow soldering profiles for lead-free processes. Ensure the single-row 24-position layout matches the target PCB design constraints before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a low-profile, surface-mount solution is required for high-density connections. The 2mm pitch offers a balance between signal density and spacing reliability. Consider the unshrouded design for applications where mating guides are provided by the counterpart connector or mechanical structure.

Headers, Male Pins Part Context

This part belongs to the A-SL200 series, which includes various through-hole and surface mount options. The EG designation typically indicates a straight header configuration, while the MR1 suffix specifies the surface mount variant. This series is designed for general-purpose electronic interconnects requiring robust performance.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 24-pin count, 2.00mm pitch, and surface mount termination. Verify that alternative manufacturers offer identical housing materials and contact plating specifications to maintain electrical and thermal performance equivalence.