A-SL254EG15-058KPB01

Headers, Male Pins Overview

The A-SL254EG15-058KPB01 is a connector header designed for through-hole mounting. It features a 15-position configuration with a 0.100-inch (2.54mm) contact spacing. The component utilizes gold-plated contacts to ensure reliable signal transmission and corrosion resistance. Constructed with a thermoplastic housing, it provides mechanical stability and electrical insulation for standard PCB applications.

Headers, Male Pins Feature Summary

• Through-hole mounting technology for secure PCB attachment
• Gold-plated contacts for enhanced conductivity
• Thermoplastic housing material for durability

Headers, Male Pins Applications

• General-purpose electronic circuit boards
• Industrial control systems
• Consumer electronics assemblies

Headers, Male Pins Procurement Notes

Verify the specific pin count and pitch against design requirements before procurement. Confirm that the through-hole footprint matches the target PCB layout. Ensure compatibility with standard assembly processes. Check housing material specifications for environmental resistance needs. Validate contact plating requirements for intended operational conditions.

Headers, Male Pins Selection Notes

Select this component when a 15-position header with 2.54mm spacing is required. Consider through-hole mounting for robust mechanical connections. Evaluate thermal and current ratings against application loads. Compare housing materials for environmental exposure. Ensure availability of mating connectors with compatible interfaces.

Headers, Male Pins Part Context

This part belongs to the Assmann WSW Components series of standard interconnect solutions. The manufacturer specializes in connectors and cable harnesses. This specific model represents a common header configuration used in various electronic assemblies. It aligns with industry-standard dimensions for easy integration.

Headers, Male Pins Replacement Considerations

Substitute parts must match the 15-position count and 2.54mm pitch exactly. Verify through-hole compatibility and housing material properties. Ensure equivalent contact plating and current ratings. Cross-reference mechanical dimensions for PCB footprint alignment.