A-SL254EG39-027ZPB01

Headers, Male Pins Overview

The A-SL254EG39-027ZPB01 is a connector header manufactured by ASSMANN WSW Components. It features 39 positions with a 2.54 mm (0.100 inch) pitch. The component utilizes through-hole mounting for secure PCB attachment. The contacts are designed for reliable signal transmission in electronic assemblies.

Headers, Male Pins Feature Summary

• Through-hole mounting configuration
• Single row header design
• Standard 2.54 mm contact spacing

Headers, Male Pins Applications

• General purpose circuit board interconnections
• Industrial control system wiring
• Electronic equipment signal routing

Headers, Male Pins Procurement Notes

Verify the specific part number against official manufacturer documentation to ensure compatibility with target PCB layouts and mating connectors. Confirm that the through-hole termination method aligns with the assembly process requirements. Check for RoHS compliance status if environmental regulations apply to the final product deployment.

Headers, Male Pins Selection Notes

Select this component when a 39-position straight header with 2.54 mm pitch is required for through-hole applications. Ensure the mechanical dimensions of the housing fit within the available board space. Verify that the current rating and voltage specifications meet the circuit design requirements before integration into the final assembly.

Headers, Male Pins Part Context

This part belongs to the ASSMANN WSW Components catalog, which specializes in connectors and cable assemblies. The company provides various connector solutions for industrial and commercial electronics. This specific header is part of their standard range of pin headers designed for reliable connectivity in electronic systems.

Headers, Male Pins Replacement Considerations

Compatible substitutes must match the 39 position count, 2.54 mm pitch, and through-hole mounting style. Verify that alternative parts maintain identical mechanical dimensions and electrical ratings to ensure seamless interchangeability without redesigning the PCB footprint.