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A-WBP-D002EA-11TB01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 1.25MM, 11. Review the specifications below when checking this part for your BOM.
The A-WBP-D002EA-11TB01 is a male pin header connector manufactured by Assmann WSW Components. It features an 11-position configuration with a 1.25mm (0.049 inch) pitch. The component utilizes through-hole mounting and is designed in a right-angle orientation for vertical board integration. Contact materials are constructed from brass, providing reliable electrical conductivity. The housing is made of polyamide (PA66), ensuring structural integrity and thermal stability during operation.
Verify the specific part number against manufacturer documentation to confirm the 11-position count and 1.25mm pitch specifications. Ensure that the right-angle through-hole form factor aligns with the target PCB layout requirements. Confirm material composition details regarding brass contacts and polyamide housing if environmental or thermal constraints apply to the final assembly.
Select this component when a low-profile, right-angle male header is required for dense circuit layouts. The 1.25mm pitch allows for higher density compared to standard 2.54mm headers. Verify that the through-hole mounting method is compatible with the manufacturing process and that the right-angle orientation does not conflict with adjacent components or enclosure boundaries.
This component belongs to the A-WBP series of connectors produced by Assmann WSW Components. The series includes various configurations of male pin headers designed for through-hole applications. These connectors are typically used in consumer electronics and industrial equipment where reliable signal transmission and compact form factors are necessary for system integration.
Compatible substitutes must maintain the 1.25mm pitch, 11-position count, and right-angle through-hole mounting style. Verify that alternative parts offer equivalent current ratings and utilize similar insulating materials such as polyamide. Ensure mechanical dimensions match the existing footprint to avoid rework.
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