A-WBP-D002EG-14SR01

Headers, Male Pins Overview

The A-WBP-D002EG-14SR01 is a surface mount board-to-board connector header from the Wafer D002 series by Assmann WSW Components. It features a 14-position configuration with a 1.25mm (0.049 inch) pitch. The component utilizes tin-plated contacts and is designed for through-hole or surface-mount termination, supporting reliable electrical interconnection in compact electronic assemblies.

Headers, Male Pins Feature Summary

• Surface mount design for automated PCB assembly
• Compact 1.25mm pitch for high-density applications
• Tin-plated contacts for corrosion resistance

Headers, Male Pins Applications

• Consumer electronics internal connections
• Industrial control module interconnects
• Telecommunications equipment boards

Headers, Male Pins Procurement Notes

Verify the specific contact plating material and insulation rating against the official manufacturer datasheet before procurement. Confirm that the surface mount footprint matches the target PCB design requirements to ensure proper mechanical stability and electrical performance during operation.

Headers, Male Pins Selection Notes

Select this component when a low-profile, surface-mounted header is required for dense circuit layouts. The 1.25mm pitch allows for significant pin count within a small area. Ensure the mating connector matches the series specifications for compatible engagement and secure connection integrity.

Headers, Male Pins Part Context

This part belongs to the Wafer D002 series of connectors, which are characterized by their small form factor and suitability for modern surface-mount technology processes. The series provides various pin counts to accommodate different signal and power distribution needs within tight spatial constraints on printed circuit boards.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 14-pin count, 1.25mm pitch, and surface mount orientation. Verify that alternative components offer identical contact plating and current ratings to maintain system reliability without redesigning the PCB footprint.