A-WBP-D008EA-20SR03

Headers, Male Pins Overview

The A-WBP-D008EA-20SR03 is a wire-to-board connector header manufactured by Assmann WSW Components. It features a surface-mount, right-angle design with 20 positions and a 1.25 mm pitch. The component utilizes male pin contacts for board-to-wire interconnection. It is designed for reliable electrical connectivity in compact electronic assemblies requiring low-profile mounting solutions.

Headers, Male Pins Feature Summary

• Surface-mount right-angle configuration for space-constrained PCB layouts
• Male pin contact type for secure wire-to-board mating
• Compact rectangular header family design

Headers, Male Pins Applications

• Consumer electronics internal wiring
• Industrial control board interconnections
• Automotive electronic module connections

Headers, Male Pins Procurement Notes

Verify the exact part number against manufacturer datasheets to ensure correct pitch and contact configuration. Confirm RoHS compliance status and moisture sensitivity level requirements for your assembly process. Check for any specific ordering suffixes that may alter packaging or plating specifications before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a low-profile, right-angle surface-mount header is required for 1.25 mm pitch applications. Ensure the PCB footprint matches the specified 20-position layout. Consider thermal management and mechanical stability during reflow soldering processes for surface-mount technology integration.

Headers, Male Pins Part Context

This component belongs to the A-WBP-D008EA series of compact rectangular headers from Assmann WSW Components. The series offers various position counts and mounting styles, providing standardized interconnect solutions for modern electronic manufacturing needs.

Headers, Male Pins Replacement Considerations

Compatible substitutes include A-WBP-D008EA-20SR02 and A-WBP-D008EA-15SR02 from the same manufacturer family, provided the position count and mounting style align with the specific application requirements.