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A-WBP-K002DA-04TB01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 2.00MM, 4P. Review the specifications below when checking this part for your BOM.
The A-WBP-K002DA-04TB01 is a wire-to-board connector header manufactured by Assmann WSW Components. It features a right-angle through-hole termination style with four positions. The component utilizes a 2.00mm pitch wafer design, providing a reliable interface for flat cable applications. This specific model is part of the company's standard connector portfolio, engineered for secure board mounting and consistent electrical connectivity in electronic assemblies.
Verify the exact part number against manufacturer documentation to ensure compatibility with mating connectors. Confirm that the required pin count and pitch match the design specifications. Check for any specific packaging or handling requirements defined in the official datasheet before finalizing procurement orders.
Select this component when a right-angle, four-pin connection is required at a 2.00mm spacing. Ensure the mating connector matches the wafer series and termination type. Consider mechanical constraints such as board thickness and available vertical clearance for the right-angle profile during the design phase.
Assmann WSW Components specializes in IC sockets and IDC connectors for flat cable applications. The A-WBP-K002DA-04TB01 belongs to their wire-to-board header family, which provides standardized solutions for connecting cables to printed circuit boards in various industrial and consumer electronic systems.
Cross-reference with other 4-position, 2.00mm pitch right-angle headers from the same manufacturer series. Verify mechanical dimensions and electrical ratings before substituting with components from different manufacturers to ensure proper fit and function.
Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.

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