A-WBP-L006EG-13SR01

Headers, Male Pins Overview

The A-WBP-L006EG-13SR01 is a wire-to-board header assembly manufactured by Assmann WSW Components. It features 13 positions with a 2.50mm pitch, designed for surface mount installation. The connector utilizes a wafer-style header configuration to facilitate reliable electrical connections between wires and printed circuit boards in electronic assemblies.

Headers, Male Pins Feature Summary

• Surface mount design for automated PCB assembly processes
• Wafer header configuration ensuring stable wire-to-board connectivity
• Standardized 2.50mm pitch spacing for compatible mating components

Headers, Male Pins Applications

• Consumer electronics internal wiring
• Industrial control board interconnections
• Automotive electronic module connections

Headers, Male Pins Procurement Notes

Verify the specific suffix SR01 against the manufacturer's latest datasheet to confirm pinout orientation and plating specifications. Ensure compatibility with existing PCB footprint designs before procurement. Cross-reference the 13-position count and 2.50mm pitch requirements with system schematics to prevent integration errors during the sourcing phase.

Headers, Male Pins Selection Notes

Select this component when surface mount technology is required for 13-position interconnects. The 2.50mm pitch offers a balance between density and serviceability. Consider the wafer header style for applications requiring robust wire retention without additional locking mechanisms beyond standard solder joints.

Headers, Male Pins Part Context

This part belongs to the A-WBP series of header assemblies from Assmann WSW Components. The series provides various position counts and pitch options for different board space constraints. The L006EG designation typically indicates specific housing material and contact plating characteristics within the product family.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 13-position count, 2.50mm pitch, and surface mount mounting type. Verify that alternative headers maintain identical wafer header geometry and current rating specifications to ensure mechanical and electrical interchangeability in the final assembly.