SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
A-WBP-O001DA-14SR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 3.00MM, 14. Review the specifications below when checking this part for your BOM.
The A-WBP-O001DA-14SR01 is a surface mount connector header manufactured by Assmann WSW Components. It features a right-angle configuration with 14 positions. The pitch spacing is 0.118 inches (3.00mm). This component is designed for reliable electrical connections in compact electronic assemblies requiring vertical or angled board mounting solutions.
Verify the specific suffix SR01 against official datasheets to confirm plating specifications and material composition. Ensure compatibility with mating headers regarding pitch and row configuration. Confirm surface mount footprint dimensions match the target PCB layout before finalizing procurement orders.
Select this component when a right-angle, 14-pin surface mount header is required. The 3.00mm pitch suits applications needing wider spacing compared to standard 2.54mm options. Evaluate mechanical stability requirements for right-angle mounting scenarios in dense circuit boards.
Assmann WSW Components specializes in connectors, cable assemblies, and heat shrink tubing. Their product range includes IC sockets and IDC connectors for flat cable applications. This part belongs to their broader connector portfolio serving various industrial and consumer sectors.
Cross-reference compatible parts from other manufacturers offering 14-position, 3.00mm pitch right-angle headers. Verify identical pinout configurations and mechanical footprint dimensions to ensure direct interchangeability without PCB redesign.
The contact pitch is 0.118 inches, which equals 3.00mm.
This is a surface mount device (SMD) designed for soldering directly onto the PCB surface.
Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.

Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More-768x745.jpg)
A-WBP-O001DA-14SR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER,…
Read More
A-WBP-O001DA-14SR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER,…
Read More
See when an inductor behaves linearly, how DC bias and saturation reduce inductance, and which current and temperature curves to check.
Read More
A-WBP-O001DA-14SR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER,…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
A-WBP-O001DA-14SR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER,…
Read MoreA-WBP-O001DA-14SR01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER,…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More