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A-WBP-S002EG-03TB01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 4.20MM, 3P. Review the specifications below when checking this part for your BOM.
The A-WBP-S002EG-03TB01 is a wire-to-board wafer connector manufactured by Assmann WSW Components. It features a through-hole header configuration with three positions. The pitch spacing between contacts is 4.20mm, designed for reliable electrical interconnection in compact electronic assemblies.
Verify the exact suffix TB01 against the manufacturer's current datasheet to confirm plating and material specifications. Ensure the 4.20mm pitch matches the mating connector footprint. Cross-reference the package type to avoid compatibility issues during integration.
Select this component when a 4.20mm pitch is required for three-channel applications. Confirm that the through-hole termination style aligns with the printed circuit board manufacturing capabilities. Validate mechanical retention needs against the header design.
This part belongs to the Assmann WSW wire-to-board wafer series. It complements other variants in the S002EG family which differ primarily in position count and pitch dimensions. The series provides standardized solutions for internal device connectivity.
Direct substitutes within the same pitch and position count should be prioritized. Verify pinout orientation and housing color coding if visual identification is critical. Check for any updated environmental compliance declarations from alternative suppliers.
Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.

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