SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The A20H1610SSLP is a wall-mount enclosure manufactured by Hoffman Enclosures, Inc. It features a solid cover design constructed from 304 stainless steel with a #4 smooth brushed finish. The unit measures 20.00 inches in length, 16.00 inches in width, and 10.00 inches in depth (508.00mm x 406.40mm x 254.00mm). It carries NEMA 4X, IP66, Type 3, 3R, 3RX, and 12/13 ratings. The enclosure includes a steel subpanel measuring 17 inches by 13 inches and utilizes four clamps for door attachment.
Verify the specific dimensional requirements against the 20x16x10 inch specification before ordering. Confirm that the included steel subpanel dimensions of 17x13 inches meet your internal component layout needs. Ensure the installation site supports the weight of the 304 stainless steel construction. Check for compatibility with existing conduit entries or knockouts if modifications are planned.
Select this model when both mechanical durability and chemical resistance are critical. The 304 stainless steel material offers superior performance compared to standard steel or aluminum in harsh environments. The NEMA 4X rating ensures suitability for wet and corrosive conditions. Consider the fixed internal subpanel size when planning component density and wiring space.
This part belongs to the Hoffman A4S series of stainless steel wall-mount enclosures. It is designed for applications demanding robust protection standards. The series typically includes various sizes to accommodate different equipment footprints while maintaining consistent material and rating specifications across the product line.
Direct substitutes must match the 304 stainless steel material, NEMA 4X rating, and approximate external dimensions. Verify that alternative models include a compatible subpanel size or allow for custom fabrication. Ensure the replacement maintains the same clamp-based door security mechanism.

Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More