AM29843PC

Latches Overview

The AM29843PC is a single-function, 9-bit D Latch manufactured by Advanced Micro Devices. It operates on a 5 V supply voltage and features TTL logic compatibility with three-state outputs. The device is housed in a 24-pin Plastic Dual In-Line Package (DIP). Key electrical specifications include a maximum output current of 0.048 A, a nominal propagation delay of 12 ns at nominal supply, and a maximum power supply current of 97 mA. It supports an operating temperature range from -55 °C to +70 °C.

Latches Feature Summary

• Provides 9-bit data storage capability via a single D latch function
• Features three-state outputs for bus-compatible interfacing
• Compatible with standard TTL logic families

Latches Applications

• Parallel data buffering in digital systems
• Temporary data storage in microprocessor interfaces
• Logic level translation between TTL components

Latches Procurement Notes

Verify the manufacturer origin carefully, as AMD's semiconductor division was acquired by GlobalFoundries. Confirm that the specific part number corresponds to the original AMD production run if vintage sourcing is required. Check RoHS compliance status, as older AMD logic parts may not meet modern environmental standards. Ensure the package type matches the specified 24-pin DIP configuration for board compatibility.

Latches Selection Notes

Select this component when a parallel 9-bit latch with three-state output control is required within a TTL-based design. Consider the 5 V operating voltage constraint and the thermal limits defined by the commercial/industrial temperature range. Evaluate the 12 ns propagation delay against system timing requirements to ensure signal integrity is maintained during data latching operations.

Latches Part Context

The AM29843 series belongs to the family of high-speed CMOS logic devices produced by Advanced Micro Devices. These latches are designed for applications requiring reliable data retention and bus isolation. The PC suffix typically denotes the plastic dual in-line package variant, distinguishing it from ceramic or other packaging options available within the same logical family.