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APT25M100J is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MOSFET N-CH 1000V 25A ISOTOP. Review the specifications below when checking this part for your BOM.
The APT25M100J is a discrete power MOSFET module manufactured by Microchip Technology, housed in an ISOTOP-4 package. It features a single N-channel configuration with a built-in diode and an isolated case connection. Key electrical parameters include a minimum drain-source breakdown voltage of 1000 V, a maximum continuous drain current of 25 A, and a maximum on-resistance of 0.33 Ω. The device supports avalanche-rated operation with an energy rating of 2165 mJ.
Verify the specific datasheet version and manufacturer documentation to confirm exact pinout configurations and thermal characteristics before integration. Ensure that the ISOTOP-4 package dimensions align with the intended heatsink or board layout requirements. Cross-reference the avalanche energy rating with system transient specifications to validate operational safety margins under fault conditions.
Select this component when a 1000 V rated MOSFET with integrated diode functionality is required in a screw-mountable form factor. The 25 A current capacity and 0.33 Ω resistance define its suitability for moderate-power industrial loads. Consider the isolated case feature if electrical isolation from the chassis is necessary without additional insulators.
This part belongs to the Microchip Power MOS series, specifically designed as a discrete semiconductor module. It utilizes the ISOTOP packaging technology, which facilitates direct mounting to heat sinks. The product line targets applications demanding reliable high-voltage switching capabilities in a compact, standardized footprint.
The APT21M100J is a documented alternative within the same family, offering similar voltage ratings but with a lower continuous drain current of 21 A and slightly higher on-resistance. Verify compatibility regarding thermal dissipation and package mounting holes before substitution.
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