APTM50UM09FAG

Single FETs, MOSFETs Overview

The APTM50UM09FAG is a single N-channel Power MOSFET module manufactured by Microchip Technology. It utilizes Silicon (Si) FREDFET technology and is housed in an SP6C chassis mount package. The device features a drain-source voltage (VDSS) of 500 V and a typical on-resistance (RDSon) of 9 mΩ. It supports a continuous drain current of 371 A at a case temperature of 80°C, with a maximum power dissipation of 5000 W under the same thermal conditions. The component operates within a junction temperature range of -40°C to 150°C.

Single FETs, MOSFETs Feature Summary

• Integrates a single N-channel switch utilizing FREDFET silicon technology for optimized switching performance.
• Designed for chassis mounting using the SP6C package format to facilitate high-power thermal management.
• Provides high current handling capability suitable for demanding industrial power conversion applications.

Single FETs, MOSFETs Applications

• Industrial motor drives
• Uninterruptible power supplies (UPS)
• High-frequency DC-DC converters

Single FETs, MOSFETs Procurement Notes

Verify the specific ordering suffix and revision level against the official Microchip Technology datasheet before procurement. Ensure that the SP6C package dimensions and thermal interface requirements match the target chassis design. Confirm RoHS compliance status and check for any active Product Change Notifications (PCNs) that may affect pinout or material composition. Cross-reference the manufacturer part number with authorized distributor catalogs to ensure authenticity.

Single FETs, MOSFETs Selection Notes

Select this component when a single-switch configuration with 500V blocking capability and high current capacity is required. The 9 mΩ on-resistance offers low conduction losses compared to higher resistance alternatives. Consider the SP6C chassis mount form factor if board-level packaging is insufficient for the thermal load. Evaluate the 371A current rating against peak and RMS load requirements to ensure adequate safety margins during operation.

Single FETs, MOSFETs Part Context

This module belongs to the Microchip APTM series of discrete and power modules. It is categorized under MOSFET modules and utilizes standard silicon technology. The SP6C package is a standardized chassis-mount footprint designed for high-power density applications. This specific part represents a single-switch solution within the broader portfolio of power semiconductor devices offered by the manufacturer.

Single FETs, MOSFETs Replacement Considerations

Consult the official Microchip Technology cross-reference documentation for verified substitute part numbers. Do not assume functional equivalence with other brands without verifying electrical parameters and pin compatibility. Review datasheets for alternative SP6C packages to confirm matching voltage, current, and thermal specifications.

Single FETs, MOSFETs FAQ

What is the maximum power dissipation of the APTM50UM09FAG?

The maximum power dissipation is 5000 W when measured at a case temperature of 80°C.

Does the APTM50UM09FAG use Silicon Carbide technology?

No, the APTM50UM09FAG utilizes standard Silicon (Si) FREDFET technology, not Silicon Carbide.

What is the operating junction temperature range?

The operating junction temperature range is from -40°C to 150°C.