AS6C3216-55BIN

Memory IC Overview

The AS6C3216-55BIN is an asynchronous CMOS static random-access memory (SRAM) manufactured by Alliance Memory. It provides a storage capacity of 32 Mbit, organized as 2M x 16 bits. The device features a maximum random access time of 55 ns and operates within a supply voltage range of 2.7 V to 3.6 V. It utilizes a parallel interface and is housed in a 48-pin Thin Fine-pitch Ball Grid Array (TFBGA) package. The component supports surface mount technology and functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Asynchronous operation with high-speed data access capabilities
• Low power consumption design for efficient energy usage
• Industrial temperature rating for robust environmental performance
• Compact TFBGA packaging for space-constrained applications

Memory IC Applications

• Data buffering in embedded systems
• Cache memory in microprocessor architectures
• Industrial control system data storage
• Telecommunications equipment memory modules

Memory IC Procurement Notes

Verify the specific suffix BIN indicates the TFBGA-48 package configuration against official datasheets. Confirm RoHS compliance status through manufacturer documentation. Ensure the 2.7V to 3.6V voltage range matches your system requirements. Check for moisture sensitivity classification if reflow soldering is planned. Validate lead-free manufacturing standards for regulatory adherence.

Memory IC Selection Notes

Select this component when a 32 Mbit density with 16-bit word width is required. The 55 ns speed suits moderate-frequency asynchronous interfaces. The TFBGA-48 package offers a compact footprint compared to TSOP alternatives. Consider the low power characteristics for battery-operated or thermally sensitive designs. Verify compatibility with existing PCB land patterns for TFBGA mounting.

Memory IC Part Context

This part belongs to the Alliance Memory AS6C3216 series of asynchronous SRAMs. The series includes variants with different access times and package options. The AS6C3216-55BIN specifically denotes the 55 ns speed grade in the TFBGA package. It complements other densities like 16 Mbit and 64 Mbit parts in the same family.

Memory IC Replacement Considerations

Check for direct pin-compatible substitutes within the AS6C3216 series. Verify equivalent speed grades and voltage ranges for cross-referencing. Ensure package dimensions match for mechanical fit. Consult manufacturer obsolescence notices for lifecycle status.