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AUIRF2804 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 40V 195A TO220. Review the specifications below when checking this part for your BOM.
The AUIRF2804 is an automotive-grade N-channel HEXFET power MOSFET with a 40V drain-source breakdown voltage. It features ultra-low on-resistance, typically 1.5mΩ and maximally 2.0mΩ at VGS=10V. The device supports a continuous drain current of 270A (silicon limited) or 195A (package limited). It operates within a junction temperature range of -55°C to +175°C and offers fast switching capabilities with a maximum turn-on delay of 13ns and rise time of 120ns.
Verify the specific package variant required for the design, as the base model corresponds to the TO-220AB through-hole package. Confirm that the ordering suffix matches the intended form factor, such as Tube for standard packages or Tape and Reel for surface mount variants like the D2Pak version. Ensure compliance with the specified automotive qualification level before finalizing procurement.
Select this component when designing circuits requiring robust automotive reliability and high current handling in a compact footprint. The device is suitable for applications demanding low conduction losses and high thermal stability. Consider the package limitations for continuous current ratings if using lead-mounted configurations. Evaluate the repetitive avalanche energy requirements against the system's inductive load characteristics.
This part belongs to Infineon's HEXFET family of power MOSFETs, specifically engineered for automotive environments. It utilizes advanced processing techniques to achieve low on-resistance per silicon area. The product line includes various package options, including TO-220AB, D2Pak, and TO-262, all sharing similar electrical performance characteristics while differing in physical mounting and thermal dissipation properties.
Direct substitutes include IRF2804PbF and IRF2804SPbF. Verify pinout compatibility and thermal resistance values when transitioning between different package types within the same electrical specification family.
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