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AUIRF6218S is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET P-CH 150V 27A D2PAK. Review the specifications below when checking this part for your BOM.
The AUIRF6218S is an automotive-grade P-channel HEXFET power MOSFET manufactured by Infineon Technologies. It features a D2-Pak (TO-263AB) package and utilizes advanced planar technology to achieve low on-resistance per silicon area. The device supports continuous drain currents of -27A at 25°C case temperature and handles pulsed currents up to -110A. Key electrical parameters include a maximum RDS(on) of 150mΩ, a breakdown voltage of -150V, and a junction temperature range of -55°C to +175°C. It is fully avalanche rated with single pulse energy capability of 210mJ.
Verify that the specific orderable part number matches the required package variant, as the datasheet lists both tube and tape-and-reel forms. Confirm compliance with RoHS directives and ensure storage conditions adhere to the specified Moisture Sensitivity Level 1 classification to prevent package damage during soldering processes.
Select this component when designing automotive systems requiring a P-channel solution with high current handling capabilities and proven ruggedness. The wide operating temperature range and avalanche rating make it suitable for harsh environments where transient overvoltages or inductive loads are present. Ensure gate drive voltages remain within the specified limits to maintain optimal on-state resistance.
This device belongs to the HEXFET family of power MOSFETs from Infineon Technologies. It represents the automotive-grade extension of industrial components, offering enhanced qualification standards while maintaining similar electrical performance profiles. The product line focuses on providing reliable power switching solutions for demanding transportation and industrial sectors.
The AUIRF6218L serves as the pin-compatible alternative utilizing the TO-262 package instead of the D2-Pak form factor. Designers must verify thermal dissipation requirements and PCB footprint compatibility when substituting between these two package types.
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