B0922N7575AHF

Balun Overview

The B0922N7575AHF is an ultralow profile balun manufactured by TTM Technologies under the Xinger brand. It operates within a frequency range of 950 MHz to 2.15 GHz and provides impedance transformation between 75 Ohm unbalanced and 75 Ohm balanced ports. The component features an insertion loss of 0.55 dB and utilizes a 0404 (1010 metric) surface-mount package. It supports board mounting and functions reliably across a temperature range of -55°C to +85°C.

Balun Feature Summary

• Provides signal conditioning through balanced-to-unbalanced conversion for RF applications
• Designed with an ultralow profile structure to minimize vertical space requirements on circuit boards
• Utilizes surface-mount technology for automated assembly integration

Balun Applications

• Wireless communication systems requiring impedance matching
• RF signal processing circuits in consumer electronics
• Broadband infrastructure equipment operating in the specified frequency band

Balun Procurement Notes

Verify the specific ordering suffix and packaging configuration when placing orders, as availability may vary between cut tape, reel, or MouseReel formats. Confirm RoHS compliance status and lead times directly with authorized distributors or the manufacturer prior to procurement. Ensure that the selected variant matches the required impedance and frequency specifications for the intended design application.

Balun Selection Notes

Select this component when designing circuits that require a 75-ohm to 75-ohm balun solution within the 950 MHz to 2.15 GHz bandwidth. The 0404 package size is suitable for high-density layouts where minimal footprint is critical. Consider the insertion loss and operational temperature range to ensure compatibility with system performance requirements and environmental conditions.

Balun Part Context

This part belongs to the Xinger series of passive RF components produced by TTM Technologies. The series focuses on providing compact signal conditioning solutions for modern electronic devices. Baluns in this lineup are engineered to support various wireless standards and broadband applications by ensuring efficient power transfer and signal integrity across defined frequency ranges.

Balun Replacement Considerations

Consult official substitution guides from TTM Technologies for verified alternatives. Cross-referencing with other models in the B0922 series may provide options with different impedance ratios or frequency ranges if the current specification does not fully meet design needs.