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BD33GA3VEFJ-ME2 is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is IC REG LIN 3.3V 300MA 8-HTSOP-J. Review the specifications below when checking this part for your BOM.
The BD33GA3VEFJ-ME2 is a high-accuracy low-dropout (LDO) voltage regulator manufactured by ROHM Semiconductor, designed for automotive applications. It provides a fixed positive output voltage of 3.3 V with a maximum output current of 300 mA. The device operates within an input voltage range of 4.5 V to 14 V and supports an extended operating temperature range from -40°C to +105°C. Key electrical characteristics include a typical dropout voltage of 0.6 V at full load and a circuit current of 0.6 mA. The regulator is housed in an HTSOP-J8 surface-mount package.
Verify the specific suffix ME2 confirms automotive grade qualification and RoHS compliance before procurement. Confirm the HTSOP-J8 package availability matches your PCB footprint requirements. Ensure the supplier provides traceability documentation suitable for automotive manufacturing standards. Check for any obsolescence notices as this part may have specific lifecycle statuses.
Select this component when a fixed 3.3V output is required with moderate current capability up to 300 mA. It is suitable for designs needing wide input voltage tolerance up to 14 V. Consider this part for space-constrained applications due to its compact HTSOP-J8 package. Evaluate thermal performance based on the expected load current and ambient temperature conditions.
This regulator belongs to ROHM's automotive-grade LDO series, characterized by high accuracy and robust protection features. The BD33GA3VEFJ-ME2 variant specifically targets applications demanding reliability in harsh environments. It complements other parts in the family by offering a balance between current capacity and power dissipation capabilities.
Consult official substitution guides for equivalent automotive LDOs with matching pinouts and electrical specifications. Verify compatibility with existing thermal management solutions if replacing higher-power variants.
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