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BL 15 SMD 089 11 B TR is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is for 0.635 mm and up to 0.85 mm. Review the specifications below when checking this part for your BOM.
The BL 15 SMD 089 11 B TR is a surface mount board-to-board connector manufactured by Fischer Elektronik. It features an 11-position female header configuration with a 2.54 mm (0.100 inch) pitch. The component utilizes gold plating for contact surfaces to ensure reliable signal transmission and corrosion resistance. Designed for reflow soldering processes, it meets UL 94 V-0 flammability standards. The specific insulation resistance exceeds 10^7 Ω·m, ensuring high dielectric integrity between adjacent contacts.
Verify the exact part number suffix against official Fischer Elektronik documentation to confirm reel packaging specifications and pin count accuracy. Ensure compatibility with standard reflow soldering profiles. Cross-reference datasheet dimensions and terminal configurations before integration into PCB designs to prevent mechanical mismatches.
Select this component when a surface mount female header with 11 positions is required. Verify that the mating connector matches the 2.54 mm pitch and gold-plated contact requirements. Confirm that the PCB layout supports the specified footprint and reflow soldering thermal profile without damaging the insulating body.
This part belongs to the BL 15 SMD 089 series of board connectors from Fischer Elektronik. The series offers various position counts and termination styles tailored for different mounting needs. Components in this family share common dimensional characteristics and material specifications while varying in contact quantity and packaging format.
Direct substitutes must match the 11-position count, 2.54 mm pitch, surface mount orientation, and gold plating specification. Verify that alternative components meet identical UL 94 V-0 ratings and reflow solderability requirements to maintain assembly process compatibility.
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