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BL 3 23 Z is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is Stamped contact spring (fork con. Review the specifications below when checking this part for your BOM.
BL 3 23 Z is a through-hole header connector from Fischer Elektronik's BL 3 series. It features 23 positions with a 0.100 inch (2.54 mm) pitch. The contacts are tin-plated copper alloy, designed for reliable signal transmission. This component utilizes a stamped contact spring mechanism, classified as a fork contact, which allows for flexible configuration to accommodate specific circuit requirements. The connector is intended for PCB mounting and supports standard industrial soldering processes.
Verify the exact part number against manufacturer documentation to ensure compatibility with required pin counts and pitch specifications. Confirm that the tin-plated contact material meets the environmental and conductivity requirements of the target application. Check for any specific handling instructions related to the stamped spring contact structure during assembly.
Select this component when a flexible, customizable header solution is needed. The fork contact design allows for adapting the number of positions without changing the base product family significantly. Ensure the 2.54 mm pitch aligns with the mating connector and PCB layout constraints. Consider the tin plating for general-purpose applications where gold plating is not strictly necessary.
The BL 3 series by Fischer Elektronik consists of stamped contact springs designed as fork contacts. These connectors offer a separable pitch of 0.635 mm, enabling flexible configuration. The BL 3 23 Z specifically provides 23 positions, fitting into the broader category of rectangular headers used for reliable electrical connections in various electronic assemblies.
Consult Fischer Elektronik official documentation for direct substitutes or alternative pin counts within the BL 3 series. Verify mechanical dimensions and contact material compatibility before swapping components.
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