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BL LP 3 31 S is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is for 0.635 mm. Review the specifications below when checking this part for your BOM.
The BL LP 3 31 S is a header connector manufactured by Fischer Elektronik, designed for through-hole mounting on printed circuit boards. It features a single row of contacts with a standard 0.100-inch (2.54 mm) pin spacing to ensure compatibility with industry-standard PCB layouts. The component utilizes gold-plated contact surfaces to provide reliable electrical conductivity and corrosion resistance over repeated mating cycles. This specific model accommodates 31 positions, offering a high-density interconnection solution for applications requiring robust signal transmission in compact electronic assemblies.
Verify the exact pin count and contact plating specifications against the official Fischer Elektronik datasheet before procurement. Ensure that the selected variant matches the required current rating and voltage tolerance for the specific application environment. Confirm that the through-hole footprint aligns precisely with the target PCB design to prevent assembly errors.
Select this component when a single-row, 31-position header with 2.54 mm spacing is required for through-hole implementation. Consider the gold plating for environments where corrosion resistance is critical. Evaluate the mechanical stability provided by the through-hole design compared to surface-mount alternatives for vibration-prone applications.
This part belongs to the BL LP series of header connectors from Fischer Elektronik, which are characterized by their standardized 0.100-inch spacing and through-hole construction. The series offers various position counts to accommodate different interconnection needs while maintaining consistent mechanical and electrical performance standards across the product line.
Direct substitutes must match the 31-position count, 2.54 mm pitch, single-row configuration, and through-hole mounting style. Verify that any alternative component provides equivalent gold plating thickness and current carrying capacity to maintain system reliability without redesigning the PCB footprint.
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