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BLM6G10-30G,118 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Ampleon USA Inc.. Its product description is IC RF AMP CDMA 920-960MHZ 16HSOP. Review the specifications below when checking this part for your BOM.
The BLM6G10-30G,118 is an RF amplifier IC designed for W-CDMA applications. It operates within a frequency range of 920MHz to 960MHz and requires a supply voltage of 28V. The device is housed in a 16-HSOP surface-mount package. This component serves as a specialized integrated solution for wireless communication systems requiring amplification within the specified band.
Verify part authenticity through authorized Ampleon distributors. Confirm that the 16-HSOP package matches your PCB footprint requirements. Check datasheet specifications for thermal management needs associated with 28V operation. Ensure compliance with RoHS standards if required by your manufacturing process. Validate frequency range compatibility with your specific system design before procurement.
Select this component when designing for W-CDMA bands between 920MHz and 960MHz. Consider the 28V supply requirement and 16-HSOP package constraints during layout. Evaluate thermal performance characteristics against your enclosure design. Compare integration benefits against discrete solutions for size and efficiency. Verify interface compatibility with surrounding RF circuitry.
This device belongs to Ampleon's portfolio of RF amplifiers targeting cellular communication standards. It integrates power handling and gain stages into a single compact package. The HSOP form factor supports high-volume manufacturing processes. It addresses the need for efficient signal conditioning in mobile network infrastructure.
The manufacturer lists this product as discontinued. Identify alternative components from current Ampleon lines or other suppliers offering similar W-CDMA specifications. Ensure replacement parts match the 920-960MHz frequency range and 28V operating voltage. Verify pinout compatibility with existing 16-HSOP footprints to minimize redesign efforts.
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