BLP 1 16

Headers, Receptacles, Female Sockets Overview

The BLP 1 16 is a high-precision female header connector manufactured by Fischer Elektronik. It features 16 positions with a 0.100-inch (2.54mm) pitch. The component utilizes gold plating and is designed for through-hole mounting on printed circuit boards.

Headers, Receptacles, Female Sockets Feature Summary

• High-precision female header construction
• Gold-plated contacts for reliable conductivity
• Through-hole mounting configuration

Headers, Receptacles, Female Sockets Applications

• General electronic circuit interconnections
• PCB-to-PCB signal transmission
• Industrial control system interfaces

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific pin count and pitch against project requirements before ordering. Confirm that the through-hole mounting style aligns with the PCB layout design. Ensure compatibility with mating male headers regarding contact dimensions and plating specifications to guarantee proper electrical connection.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a standard 2.54mm pitch female header is required for through-hole assembly. Consider the gold plating for corrosion resistance and durability in demanding environments. Evaluate the 16-position capacity against signal routing needs to ensure optimal board space utilization and connectivity density.

Headers, Receptacles, Female Sockets Part Context

This part belongs to Fischer Elektronik's range of high-precision connectors, known for quality manufacturing standards. The BLP series typically offers robust mechanical stability and consistent electrical performance for various industrial and commercial electronics applications requiring reliable signal transmission.

Headers, Receptacles, Female Sockets Replacement Considerations

Direct substitutes must match the 16-pin count, 2.54mm pitch, and through-hole mounting type. Verify that alternative components offer equivalent gold plating and female header configurations to maintain interface compatibility without redesigning the PCB footprint.