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BV302D12010 is listed in the Power Transformers range at ChipApex. The manufacturer field lists Zettler Magnetics. Its product description is 230V INPUT 1VA PWR XFMR. Review the specifications below when checking this part for your BOM.
The BV302D12010 is a 1VA encapsulated power transformer manufactured by Zettler Magnetics. It features a 230V primary winding and a single 12V secondary output capable of delivering 42mA. The component utilizes a laminated core design with EI30-10.5 geometry, supporting operation at temperatures of 120°C or higher. Designed for through-hole mounting, this unit provides standard isolation for low-power AC-to-DC conversion applications requiring compact form factors.
Verify the specific suffix designation against official Zettler Magnetics documentation to ensure correct voltage and current ratings. Confirm that the through-hole package dimensions match the target PCB layout. Cross-reference the 1VA rating and 12V output specifications with the system requirements to prevent mismatched performance expectations during integration.
Select this model when a compact, encapsulated solution is required for 230VAC input systems. The 1VA capacity suits low-load applications where space constraints limit larger transformers. Ensure the 42mA secondary current meets the downstream circuit demands. The through-hole format is appropriate for assemblies prioritizing mechanical robustness over surface-mount density.
This component belongs to the BV series of encapsulated power transformers from Zettler Magnetics. The series offers output loads ranging from 0.6VA to 10VA, targeting diverse product categories. The BV302D12010 specifically addresses the 1VA segment, providing a standardized solution for industrial and consumer electronics requiring reliable isolation and compact packaging.
Consult the official BV series catalog for direct substitutes. Potential alternatives include models with identical 1VA ratings and 12V outputs, such as variants within the same encapsulated family. Verify pinout compatibility and physical footprint before substitution.
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