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CCLH100 TR TIN/LEAD is listed in the Current Regulation - Diodes, Transistors range at ChipApex. The manufacturer field lists Central Semiconductor Corp. Its product description is 50V 10MA TH DIODE-CURRENT LIMITI. Review the specifications below when checking this part for your BOM.
The CCLH100 is a current regulator diode manufactured by Central Semiconductor Corp, designed for applications requiring stable current regulation. It features a nominal regulating current of 12 mA and supports a maximum operating voltage of 100 V. The device is housed in a DO-35-2 axial leaded package, suitable for through-hole mounting. It offers a power dissipation rating of 600 mW and operates within a temperature range of -65°C to +200°C. The component is supplied in reel packaging and complies with RoHS standards.
Verify the specific ordering suffix 'TR TIN/LEAD' to confirm reel packaging and tin/lead plating specifications. Ensure compatibility with through-hole assembly processes given the DO-35-2 package style. Confirm RoHS compliance status and thermal management requirements for the 600 mW power dissipation rating during integration.
Select this component when a fixed 12 mA current source is required across a wide voltage range up to 100 V. Consider the DO-35-2 package size for board space constraints and the extended temperature range for harsh environments. Evaluate the 600 mW power dissipation capability against expected thermal loads in the target application circuit design.
The CCLH100 belongs to the CCL series of current regulator diodes from Central Semiconductor. These components function as two-terminal devices that maintain a nearly constant current over a wide range of voltages. They serve as simple alternatives to more complex three-terminal regulators in low-power applications where precise current control is essential.
The CCLH100 BK TIN/LEAD is a documented substitute variant offering identical electrical characteristics but packaged in bulk rather than reel format. Verify pinout compatibility and thermal performance when substituting between packaging types.
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