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CD74HC75NS is listed in the Latches range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DUAL 2BIT TRANS LATCH 16SO. Review the specifications below when checking this part for your BOM.
The CD74HC75NS is a dual 2-bit bistable transparent latch manufactured by Texas Instruments. It operates on a single supply voltage ranging from 2 V to 6 V and is housed in a 16-SOIC package. The device features differential outputs and independent circuits for each latch channel. Key electrical specifications include a maximum propagation delay of 10 ns, a maximum power supply current of 8 uA, and an operating temperature range from -55 C to +125 C. The component supports surface mount installation and is available in cut tape or reel packaging formats.
Verify the specific suffix NS indicates the 16-SOIC package variant when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure static-sensitive handling protocols are followed during assembly due to CMOS construction. Cross-reference pinout diagrams with the official datasheet to prevent mounting errors on PCB layouts.
Select this component when dual independent latching functionality is required in a compact surface-mount form factor. The differential output capability distinguishes it from standard single-ended latch alternatives. Consider the 10 ns propagation delay for timing-critical applications within the specified voltage range. Evaluate thermal management requirements given the extended operating temperature limits.
This part belongs to the CD74HC75 series of dual 2-bit bistable transparent latches. It shares functional similarities with other HC-series logic devices but offers specific package and performance characteristics tailored for space-constrained designs. The NS suffix denotes the small-outline integrated circuit package type used in this specific variant.
Compatible substitutes include the CD74HC75E and CD74HC75M variants, which offer identical logical functionality in different package styles such as DIP or SOIC. Verify pin compatibility and package dimensions before substituting to ensure mechanical fit.
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