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CD74HCT640E is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC TRANSCEIVER INVERT 5.5V 20DIP. Review the specifications below when checking this part for your BOM.
The CD74HCT640E is an octal bus transceiver from the Texas Instruments CD74HCT series, designed for high-speed CMOS logic applications. It features eight independent bidirectional data channels with inverting functionality and three-state outputs. The device operates within a supply voltage range of 4.5 V to 5.5 V and supports propagation delays typical of HCT technology. Packaged in a standard 20-pin DIP format, it is suitable for industrial temperature ranges extending from -55°C to +125°C.
Verify the package type matches the required E suffix for PDIP-20 configuration. Confirm the HCT logic family compatibility with existing system voltage levels. Ensure the component meets specific industrial temperature requirements if deployed in harsh environments. Cross-reference datasheet revisions for any pinout or electrical characteristic updates before final integration.
Select this component when eight-channel bidirectional transfer with inversion is required. The HCT series ensures compatibility with standard TTL logic inputs while maintaining CMOS noise immunity. Consider the PDIP-20 package for through-hole prototyping or legacy board designs. Evaluate propagation delay specifications against system timing constraints to ensure signal integrity at target clock speeds.
This part belongs to the CD74HC/HCT640 family of octal bus transceivers. It shares functional similarities with other members like the CD74HC640M but differs in input threshold characteristics due to the HCT technology. The E suffix specifically denotes the plastic dual-in-line package variant, distinguishing it from surface-mount options within the same logical family.
Direct substitutes include the CD74HC640E for HC-level input thresholds or the SN74HCT640N for equivalent performance in alternative packaging. Verify pin compatibility and electrical parameters before swapping components to maintain circuit functionality.
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