SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CEAS07 is a gland plate sealing plug manufactured by Hoffman Enclosures, Inc. It features polyamide construction with a gland plate finish. The component measures 7 mm in height and width, with a depth of 18 mm. It serves as an accessory for enclosure cable entry points.
Verify the specific enclosure model compatibility before purchase. Confirm that the gland plate finish meets environmental requirements. Check datasheet for torque specifications if applicable. Ensure the polyamide material suits the operating temperature range. Validate dimension accuracy against existing cutouts.
Select based on required ingress protection level and cable diameter. Consider polyamide durability in industrial environments. Match the gland plate finish to existing hardware. Verify dimensional fit within the designated enclosure opening. Assess material compatibility with surrounding components.
This part belongs to the Hoffman Enclosures accessory line, designed for maintaining enclosure integrity. It complements main housing units like the A726020ULP or ASR series. The component supports standard NEMA and IP rating maintenance protocols.
No public confirmed substitute part numbers are available for this specific gland plate configuration.

A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More