CJ-12-G-002.25

Overview

Samtec Inc. CJ-12-G-002.25 is a flexible board stacking header with a 2.00 mm pitch. It features a double row configuration designed for vertical interconnect applications. The component utilizes gold-plated contacts to ensure reliable signal transmission and low contact resistance in high-density circuit board assemblies.

Feature Summary

• Flexible design accommodates misalignment during board stacking
• Double row configuration supports high-density I/O requirements
• Gold-plated contacts provide durable electrical connectivity

Applications

• High-density board-to-board interconnects
• Stacked printed circuit board assemblies
• Compact electronic device internal connections

Procurement Notes

Verify the specific part number against official Samtec documentation to confirm pin count, pitch, and termination style. Ensure compatibility with mating connectors and PCB footprint requirements before procurement. Cross-reference datasheets for mechanical dimensions and material specifications.

Selection Notes

Select this component for applications requiring flexible board stacking with a 2.00 mm pitch. Consider the double-row layout for increased I/O density within limited space. Verify that the flexible header design meets the mechanical stress and alignment tolerances of the target assembly.

Part Context

The CJ series represents Samtec's flexible board stacking headers. These components are engineered for high-reliability interconnects in compact electronic designs. The series offers various configurations to support diverse stacking heights and pin counts for modern electronics.

Replacement Considerations

Consult official Samtec substitution guides for verified alternatives. Generic equivalents may not match the precise flexibility or contact geometry required for reliable performance in high-density stacking applications.