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CP0603D0902AWTR is listed in the RF Directional Couplers range at ChipApex. The manufacturer field lists KYOCERA AVX. Its product description is RF DIR COUPLER 890-915MHZ 0603. Review the specifications below when checking this part for your BOM.
The CP0603D0902AWTR is a thin film directional coupler manufactured by KYOCERA AVX, designed for RF signal conditioning applications. It operates at a center frequency of 902 MHz with a standard coupling configuration. The component supports a maximum power rating of 3W and utilizes a 50 Ohm impedance system. It is housed in a compact 0603 (1608 metric) surface mount package, suitable for automated assembly processes. The device functions within an operating temperature range of -40°C to +85°C.
Verify RoHS compliance status prior to procurement, as documentation indicates non-compliance for this specific series. Confirm the manufacturer's standard packaging quantity matches project requirements. Ensure the ordering suffix aligns with the required reel or cut tape format. Validate that the 3W power rating meets the specific application load conditions. Check current availability through authorized distributors due to potential supply constraints.
Select this component when a 902 MHz center frequency is required for RF monitoring. The 0603 package size is optimal for dense PCB layouts. Ensure the system impedance matches the 50 Ohm specification. Consider the thermal operating range limits during design. Verify that the thin film construction meets the stability requirements of the target application environment.
This part belongs to the CP0603 High Directivity series from KYOCERA AVX. The series includes various models covering frequencies from 155 MHz to 6000 MHz. These components are engineered for signal conditioning in wireless communications. The product line emphasizes precision and reliability for modern electronic systems.
Consult official KYOCERA AVX documentation for verified substitute part numbers. Cross-reference frequency and power ratings when evaluating alternatives. Ensure package dimensions match the existing board layout.
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