CR05BS-8-T13#F10

Scrs Overview

The CR05BS-8-T13#F10 is a silicon controlled rectifier (SCR) manufactured by Renesas Electronics Corporation. It features a sensitive gate structure designed for surface mount applications in the 3-MPAK package. The device supports a repetitive peak off-state voltage of 400V and an RMS on-state current of 150mA. It operates within a standard temperature range suitable for industrial equipment and embedded electronics.

Scrs Feature Summary

• Sensitive gate architecture for reliable triggering
• Surface mount construction in 3-MPAK package
• Standard recovery characteristics

Scrs Applications

• Embedded electronics control circuits
• Industrial equipment power management
• AC switching applications

Scrs Procurement Notes

Verify component authenticity through authorized Renesas distributors. Confirm RoHS compliance status as indicated in official documentation. Check for specific ordering suffixes that may affect packaging or testing requirements. Ensure storage conditions meet moisture sensitivity level specifications to prevent damage prior to assembly.

Scrs Selection Notes

Select this SCR for applications requiring compact surface mount solutions with moderate current handling capabilities. The 400V rating suits low-voltage AC systems. Consider thermal dissipation requirements associated with the 3-MPAK package when designing heat sinks. Evaluate gate trigger sensitivity against control circuit drive capabilities.

Scrs Part Context

This component belongs to Renesas' discrete semiconductor portfolio, specifically within the silicon controlled rectifier category. It complements other SCRs like the CR02AM series, offering surface mount alternatives to traditional through-hole packages. The product line targets modern manufacturing needs for smaller form factor designs.

Scrs Replacement Considerations

Direct substitutes include the CR05BS-8-ET13#F10 variant. Verify pin compatibility and electrical ratings before substitution. Cross-reference datasheets for thermal resistance differences between package variants.