CY7C1268KV18-400BZXC

Memory IC Overview

The CY7C1268KV18-400BZXC is a 36-Mbit synchronous pipelined SRAM featuring DDR II+ architecture. It offers a density of 2 M × 18 and supports maximum operating frequencies up to 400 MHz, with data transfer rates reaching 800 MHz via double data rate interfaces. The device operates within a core voltage range of 1.7 V to 1.9 V and an I/O voltage range of 1.4 V to VDD. It utilizes a 165-ball FBGA package (13 × 15 × 1.4 mm) and provides a read latency of 2.5 cycles when the DOFF pin is asserted HIGH.

Memory IC Feature Summary

• Supports two-word burst architecture to reduce address bus frequency requirements
• Includes echo clocks (CQ/CQ) and valid data indicator (QVLD) for simplified high-speed data capture
• Features programmable output impedance via ZQ pin for system bus matching
• Incorporates IEEE 1149.1 JTAG test access port for boundary scan testing

Memory IC Applications

• High-bandwidth networking equipment requiring fast memory access
• Telecommunications systems utilizing parallel interface architectures
• Industrial control applications needing synchronous pipelined memory

Memory IC Procurement Notes

Verify component authenticity through authorized Infineon or Cypress distributors. Confirm package marking matches the specified 165-ball FBGA configuration. Ensure supply chain documentation aligns with current product lifecycle status. Request relevant quality certificates such as RoHS compliance and material declarations prior to finalizing acquisition orders.

Memory IC Selection Notes

Select this component for designs requiring 36-Mbit capacity with specific 2 M × 18 organization. Evaluate system timing constraints against the 2.5-cycle read latency specification. Consider power supply requirements for both core and I/O domains. Assess PCB layout needs for the 165-ball FBGA footprint and impedance matching resistor placement on the ZQ pin.

Memory IC Part Context

This part belongs to the CY7C1268KV18 family of DDR II+ SRAMs manufactured by Infineon Technologies. It shares architectural similarities with other members like the CY7C1270KV18 but differs in memory organization. The series targets high-performance embedded systems where low latency and high throughput are critical design parameters.

Memory IC Replacement Considerations

Public confirmed substitute part numbers: None identified.