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CYW20732ST is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC RF TXRX+MCU BLE 48LGA. Review the specifications below when checking this part for your BOM.
The CYW20732ST is a single-chip Bluetooth Low Energy System-in-Package (SiP) from Infineon Technologies, integrating an ARM Cortex-M3 core with a 2.4 GHz radio transceiver. It supports Bluetooth v4.0 and IEEE 802.15.4 standards. The device features a 32-bit data bus, operates at a maximum clock frequency of 48 MHz, and includes 320 kB of program memory and 60 kB of data RAM. It utilizes a 48-pin TFLGA package for surface mount installation.
Verify the specific suffix ST against official Infineon documentation to confirm pinout and package dimensions. Ensure compatibility with existing PCB footprints before integration. Check current availability status as supply conditions may vary. Confirm RoHS compliance requirements for your target market regulations prior to finalizing procurement orders.
Select this component when a combined MCU and BLE radio solution is required to minimize board space. The integrated design reduces external component count compared to discrete solutions. Consider the 48 MHz processing speed and memory size relative to application complexity. Evaluate the TFLGA package constraints for thermal management and assembly processes during hardware design.
This part belongs to the CYW2073x series of wireless connectivity solutions. It serves as a cost-effective alternative to separate RF and MCU components. The series targets applications requiring low power consumption and small form factors. It complements other Infineon wireless products by offering a standardized interface for rapid prototyping.
No direct public substitute part numbers are confirmed in the provided source material. Cross-referencing with similar Infineon models like CYW20735 or CYW20730 requires careful evaluation of pin compatibility and firmware differences.
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