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DAC70004IPWR is listed in the Digital To Analog Converters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DAC 14BIT V-OUT 14TSSOP. Review the specifications below when checking this part for your BOM.
The DAC70004IPWR is a quad-channel, true 14-bit digital-to-converter manufactured by Texas Instruments. It features voltage outputs and operates on a single supply ranging from 2.7 V to 5.5 V for both analog and digital domains. The device supports SPI-compatible interfaces including 3-Wire and 4-Wire modes with a maximum sampling rate of 200 kS/s per channel. It achieves a settling time of 5.8 µs and maintains integral and differential nonlinearity within ±1 LSB. Operating temperatures span from -40°C to +125°C, housed in a TSSOP-14 package.
Verify the specific suffix IPWR against official datasheets to confirm the TSSOP-14 packaging variant. Ensure the order matches the required industrial temperature range specifications. Cross-reference the manufacturer part number directly with authorized distributors to avoid counterfeit components. Confirm RoHS compliance status through current documentation before procurement.
Select this component when four independent voltage outputs are required in a compact form factor. The 14-bit resolution suits applications needing moderate precision without excessive cost. Verify that the 200 kS/s update rate meets system bandwidth requirements. Consider the TSSOP-14 package constraints regarding thermal dissipation and PCB layout space availability.
This device belongs to the DAC70004 family of ultra-small, true 14-bit quad voltage output DACs. It shares core architectural similarities with other members like the DAC70004IDMDT but differs in packaging and potentially thermal characteristics. The family emphasizes low power consumption and high accuracy for portable and industrial applications.
The DAC70004IDMDT serves as a functional alternative offering identical electrical performance in a different VSON-14 package. Verify pinout compatibility and thermal management requirements when substituting between TSSOP and VSON footprints.
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