Diode Arrays DD1000S33HE3B60BOSA1 product image

DD1000S33HE3B60BOSA1

  • Description:DIODE MODULE GP 3300V AGIHVB1303
  • Series:-

SKU:c1fc81195e51 Category: Brand:

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DD1000S33HE3B60BOSA1 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is DIODE MODULE GP 3300V AGIHVB1303. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for DD1000S33HE3B60BOSA1

  • Description:DIODE MODULE GP 3300V AGIHVB1303
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • Diode Configuration:2 Independent
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):3300 V
  • Current - Average Rectified (Io) (per Diode):1000A (DC)
  • Voltage - Forward (Vf) (Max) @ If:3.85 V @ 1000 A
  • Speed:Standard Recovery >500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:-
  • Operating Temperature - Junction:-40°C ~ 150°C
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:AG-IHVB130-3
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for DD1000S33HE3B60BOSA1

DD1000S33HE3B60BOSA1

Diode Arrays Overview

The DD1000S33HE3B60BOSA1 is a high-power IGBT module from Infineon Technologies, part of the Diodes IGBT EC3 Module series. It features a dual configuration with silicon technology and an AlSiC base plate for enhanced thermal cycling capability. The module supports a maximum collector-emitter voltage (VCEO) of 3.3 kV and a continuous collector current of 1 kA at 25°C. Power dissipation reaches 1.6 MW, operating within a temperature range of -40°C to +150°C. Designed for chassis mounting, it weighs approximately 800 g.

Diode Arrays Feature Summary

  • High power density with 1.6 MW dissipation capacity
  • AlSiC base plate for increased thermal cycling robustness
  • Dual IGBT configuration in a single chassis mount package

Diode Arrays Applications

  • High-voltage direct current (HVDC) transmission systems
  • Industrial motor drives requiring high current handling
  • Traction inverters for electric vehicles or rail transport

Diode Arrays Procurement Notes

Verify the specific ordering suffix B60BOSA1 against official Infineon documentation to confirm exact pinout and mechanical dimensions. Ensure compatibility with existing cooling structures due to the heavy weight and chassis mount design. Confirm RoHS compliance status through the manufacturer's latest environmental declaration before integration.

Diode Arrays Selection Notes

Select this module for applications demanding high voltage blocking capability and substantial continuous current flow. The AlSiC substrate offers superior thermal management compared to standard copper-based alternatives. Evaluate thermal resistance requirements carefully to maintain junction temperatures within the specified operational limits during peak load conditions.

Diode Arrays Part Context

This component belongs to Infineon’s Diodes IGBT EC3 Module series, designed for extreme power applications. The DD1000S33HE3 variant represents a high-current iteration within the 3.3 kV family. It utilizes advanced silicon planar technology optimized for low conduction losses while maintaining high switching performance suitable for grid and industrial infrastructure.

Diode Arrays Replacement Considerations

The part number DD1000S33HE3 serves as a related identifier within the same product family. Verify mechanical footprint and electrical characteristics when considering substitutes. No other specific substitute part numbers are publicly confirmed for direct replacement.

DD1000S33HE3B60BOSA1DD1000S33HE3B60BOSA1

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