DD180N18SHPSA1

Diode Arrays Overview

The DD180N18SHPSA1 is a single rectifier diode module from Infineon Technologies, utilizing Löt-Bond (Solder-Bond) technology within an industrial standard 34 mm package. It features an electrically insulated base plate and is designed for high-power applications. Key electrical parameters include a repetitive peak reverse voltage of 1800 V and a maximum average on-state current of 226 A at a case temperature of 85°C. The module exhibits a threshold voltage of 0.85 V and a slope resistance of 0.95 mΩ. Thermal performance is characterized by a junction-to-case thermal resistance of 0.14 K/W under DC conditions. The unit weighs approximately 165 g and supports a maximum junction temperature of 135°C.

Diode Arrays Feature Summary

• Utilizes Solder-Bond technology for robust internal connections
• Features an electrically insulated base plate for safety isolation
• Constructed in an industrial standard 34 mm housing format

Diode Arrays Applications

• Rectifiers for drive applications
• Rectifiers for uninterruptible power supplies (UPS)
• Battery charger rectifiers

Diode Arrays Procurement Notes

Verify the specific suffix 'HP' against official Infineon documentation to confirm any distinct material or processing variations compared to the standard DD180N18S designation. Ensure that the component matches the required insulation class and mounting torque specifications for your assembly process. Cross-reference the datasheet revision date with your quality management system requirements before finalizing procurement orders.

Diode Arrays Selection Notes

Select this module when a 34 mm footprint is required for high-current rectification up to 226 A. Consider the 0.14 K/W thermal resistance for heatsink sizing calculations. Verify that the application environment stays within the -40°C to +135°C operating range. Ensure the circuit design accommodates the 1800 V blocking capability and the specific surge current ratings provided in the datasheet.

Diode Arrays Part Context

This component belongs to the Infineon network diode module family, specifically designed for grid-connected and industrial power conversion systems. The 34 mm package size allows for standardized mounting solutions common in medium-power inverters and converters. The Solder-Bond technology distinguishes it from pressure-contact modules, offering different mechanical and thermal interface characteristics suitable for permanent, high-reliability installations.

Diode Arrays Replacement Considerations

Direct substitutes may include other 34 mm single diode modules with comparable 1800 V and 226 A ratings. Verify pinout compatibility and thermal resistance values. Modules like the DD171N18K share similar packaging but differ in current rating and contact technology. Always validate mechanical dimensions and mounting hole patterns before substitution.