DD340N22STIMHPSA1

Diode Arrays Overview

The DD340N22STIMHPSA1 is a rectifier diode module from Infineon Technologies, utilizing Löt-Bond technology within an industrial standard package. It features an electrically insulated base plate and includes pre-applied thermal interface material (TIM). Key electrical parameters include a repetitive peak reverse voltage of 2200 V, a maximum average on-state current of 330 A at a case temperature of 100 °C, and a surge current rating of 8500 A. The module has a threshold voltage of 0.81 V, a slope resistance of 0.3 mΩ, and a junction-to-case thermal resistance of 0.086 K/W.

Diode Arrays Feature Summary

• Löt-Bond technology for robust internal connections
• Electrically insulated base plate for safety isolation
• Pre-applied thermal interface material to simplify mounting

Diode Arrays Applications

• Rectifiers for drive applications
• Uninterruptible Power Supply (UPS) systems
• Battery chargers

Diode Arrays Procurement Notes

Verify the exact ordering suffix against official Infineon documentation to confirm the inclusion of pre-applied TIM. Ensure compatibility with your specific thermal management requirements by checking the provided thermal resistance values. Confirm that the mechanical dimensions and mounting torque specifications align with your existing heatsink infrastructure before finalizing procurement.

Diode Arrays Selection Notes

Select this component when high voltage blocking capability and significant surge current tolerance are required in a compact form factor. The pre-applied TIM feature reduces assembly time and ensures consistent thermal contact. Evaluate the 0.086 K/W junction-to-case thermal resistance against your system's cooling capacity to ensure reliable operation under continuous load conditions.

Diode Arrays Part Context

This module belongs to Infineon's high-power rectifier diode lineup, designed for demanding industrial environments. It represents a standardized solution for power conversion stages where reliability and efficient heat dissipation are critical. The use of Löt-Bond technology distinguishes it from pressure-contact alternatives, offering a permanent and stable interconnection method for the semiconductor chips.

Diode Arrays Replacement Considerations

Direct replacements must match the 2200 V rating, 330 A current capacity, and 50 mm base plate footprint. Verify if the replacement module requires separate application of thermal interface material or offers similar pre-applied options. Ensure the new component supports the same mounting torque specifications to maintain mechanical integrity and thermal performance.

Diode Arrays FAQ

What does the 'TIM' designation indicate in the part number?

The 'TIM' suffix indicates that the module comes with pre-applied thermal interface material on the base plate, facilitating easier installation and ensuring consistent thermal conductivity between the module and the heatsink.

Is the base plate electrically isolated?

Yes, the module features an electrically insulated base plate, which provides basic insulation according to Class 1 standards (IEC 61140), enhancing safety in grounded applications.

What is the maximum allowable junction temperature?

The maximum allowable junction temperature (Tvj max) for this rectifier diode module is 130 °C.