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DG411DY-T1-E3 is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Vishay Siliconix. Its product description is IC SWITCH SPST-NCX4 35OHM 16SOIC. Review the specifications below when checking this part for your BOM.
The DG411DY-T1-E3 is a quad single-pole single-throw (SPST) CMOS analog switch manufactured by Vishay Siliconix. It integrates four independent switches in a 16-pin SOIC surface-mount package. The device supports single or dual power supplies, with a minimum voltage of 13 V and a maximum of 44 V for single supply operation. Key electrical parameters include a maximum on-resistance of 35 Ohms, a maximum turn-on time of 175 ns, and a maximum turn-off time of 145 ns. It operates within a temperature range of -40°C to +85°C and features a maximum power dissipation of 600 mW.
Verify the specific suffix T1 indicates tape-and-reel packaging configuration when sourcing. Confirm RoHS compliance status through official manufacturer documentation as environmental declarations may vary by production batch. Ensure the SOIC-16 footprint matches the target PCB layout constraints before finalizing procurement decisions.
Select this component when a quad SPST configuration with moderate speed requirements is needed. The 35 Ohm on-resistance suits applications where signal integrity is critical but ultra-low resistance is not mandatory. Compare against DG411DQ variants if a TSSOP package is preferred for space-constrained designs.
This part belongs to the DG411 series of precision analog switches from Vishay Siliconix. The series utilizes high-voltage silicon gate CMOS technology to deliver fast switching with minimal charge injection. The DG411 family is designed for applications requiring reliable signal path management in both single and dual supply environments.
DG411DY-E3 serves as the non-tape variant of the same functional device. DG411DQ-T1-E3 offers identical electrical characteristics but utilizes a TSSOP-16 package instead of SOIC-16. Verify pinout compatibility and thermal dissipation requirements when substituting these alternatives.
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