DPAD20 TO-72 4L

$6.42

Description：DIODE ARRAY GP 45V 50MA TO-72-4
Series：DPAD

SKU:2dff23079b95 Category: Diode Arrays Brand: Linear Integrated Systems, Inc.

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Product introduction

DPAD20 TO-72 4L is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Linear Integrated Systems, Inc.. Its product description is DIODE ARRAY GP 45V 50MA TO-72-4. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for DPAD20 TO-72 4L

Description：DIODE ARRAY GP 45V 50MA TO-72-4
Series：DPAD
Mfr：Linear Integrated Systems, Inc.
Package：Bulk
Diode Configuration：2 Independent
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：45 V
Current - Average Rectified (Io) (per Diode)：50mA
Voltage - Forward (Vf) (Max) @ If：1.5 V @ 1 mA
Speed：Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr)：-
Current - Reverse Leakage @ Vr：20 pA @ 20 V
Operating Temperature - Junction：-55°C ~ 150°C
Mounting Type：Through Hole
Package / Case：TO-206AF, TO-72-4 Metal Can
Supplier Device Package：TO-72-4
Grade：-
Qualification：-

Diode Arrays datasheet and documents for DPAD20 TO-72 4L

DPAD20 TO-72 4L

Diode Arrays Overview

The DPAD20 is a silicon rectifier diode manufactured by Linear Integrated Systems, housed in a TO-72 metal package. It features a single element configuration with three terminals. The device supports a maximum forward current of 50 mA and operates within a junction temperature range of -55 °C to +135 °C. Storage temperatures extend from -65 °C to +150 °C. Continuous power dissipation is rated at 300 mW for the PAD variant.

Diode Arrays Feature Summary

Direct replacement compatibility with the Siliconix PAD series
Metal cylindrical hermetic packaging for environmental protection
High reverse breakdown voltage capability

Diode Arrays Applications

General purpose rectification circuits
Replacement for legacy Siliconix PAD components
Industrial equipment requiring hermetic sealing

Diode Arrays Procurement Notes

Verify the specific suffix against official Linear (ADI) documentation to confirm pinout and electrical tolerances. Ensure the procurement specification matches the required thermal dissipation characteristics for the intended application environment. Cross-reference the JEDEC-95 code TO-72 to validate physical footprint compatibility during integration.

Diode Arrays Selection Notes

Select this component when hermetic metal packaging is required for reliability in harsh environments. Consider the 50 mA continuous forward current limit when designing load paths. Verify that the operating junction temperature range aligns with the system's thermal management capabilities and ambient conditions.

Diode Arrays Part Context

This part belongs to the PAD series of discrete semiconductors produced by Linear Integrated Systems. The series is characterized by robust metal can construction designed for high-reliability applications. These diodes serve as direct functional equivalents to earlier industry-standard components, facilitating upgrades in existing designs without mechanical modification.