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DPX162690DT-8022B2 is listed in the RF Multiplexers range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is RF DIPLEXER 832MHZ/2.2GHZ 0603. Review the specifications below when checking this part for your BOM.
The DPX162690DT-8022B2 is a multilayer LTCC diplexer manufactured by TDK Corporation, designed for RF signal conditioning in compact electronic systems. It operates with two distinct frequency bands: a low band ranging from 704MHz to 960MHz and a high band spanning 1.71GHz to 2.69GHz. The component features a 0603 (1608 metric) surface-mount package with six printed circuit board pads. Key electrical specifications include a minimum attenuation of 20.00dB in the low band, with return losses measured at 19.7dB for the low band and 9.9dB for the high band. The device maintains a standard impedance of 50 Ohms and supports an operating temperature range starting at -40°C.
Verify component authenticity against official TDK documentation due to potential availability variations. Confirm that the specific suffix matches the required frequency parameters. Check current lifecycle status as components may transition to end-of-life phases. Ensure storage conditions comply with moisture sensitivity levels for surface-mount devices. Validate compatibility with existing PCB footprint designs before finalizing procurement orders.
Choose this component when space-constrained designs require integrated dual-band filtering without discrete solutions. Evaluate the specific return loss requirements for both frequency bands to ensure system performance meets design goals. Consider the 0603 package dimensions for layout constraints. Assess thermal management needs given the -40°C lower operating limit. Verify impedance matching requirements align with the 50 Ohm specification for optimal signal transmission.
This part belongs to the DPX series of RF diplexers produced by TDK Electronics. These components utilize Low-Temperature Co-fired Ceramic (LTCC) technology to achieve high performance in small form factors. The series targets applications demanding reliable signal separation in wireless communications. This specific model addresses niche frequency allocations common in modern cellular standards.
Public confirmed substitute part numbers are not available in the provided documentation. Consult TDK technical support for direct equivalents if this component is discontinued or unavailable. Verify that any alternative solution matches the exact frequency bands and package dimensions.
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