DSEE29-06CC

Diode Arrays Overview

The IXYS DSEE29-06CC is a HiPerDynFRED Epitaxial Diode housed in an ISOPLUS220 package with an electrically isolated back surface. It features a silicon chip on a Direct-Copper-Bond substrate for high power dissipation and provides 2500V electrical isolation between the cathode and tab. Key parameters include a repetitive peak reverse voltage (VRRM) of 600 V, an average forward current (IFAV) of 30 A at TC = 115°C, and a maximum RMS current of 60 A. The device exhibits a very short recovery time (trr) of 30 ns under specified conditions, low cathode-to-tab capacitance (<15pF), and soft reverse recovery behavior to minimize EMI/RFI.

Diode Arrays Feature Summary

• Features an electrically isolated back surface providing 2500V isolation via a Direct-Copper-Bond substrate.
• Exhibits extremely low switching losses and soft reverse recovery characteristics for reduced electromagnetic interference.
• Incorporates planar passivated chips with avalanche voltage rating for reliable operation.
• Designed with low IRM values to minimize power dissipation and turn-on loss in commutating switches.

Diode Arrays Applications

• Antiparallel diode for high frequency switching devices
• Free wheeling diode in converters and motor control circuits
• Rectifiers in switch mode power supplies (SMPS)
• Snubber diode applications
• Inductive heating systems

Diode Arrays Procurement Notes

Verify component authenticity by checking manufacturer markings against official datasheet specifications. Confirm package type matches ISOPLUS220 outline dimensions and pin configuration. Ensure thermal interface materials are compatible with the isolated back surface design. Review datasheet revision history for any updates to electrical limits or testing conditions prior to integration.

Diode Arrays Selection Notes

Select this component for applications requiring high-frequency switching with minimal reverse recovery charge. The 600 V rating suits medium-voltage converter topologies. Consider the 30 A average current capability relative to thermal management constraints. The isolated tab simplifies mounting on grounded heatsinks without additional insulators. Evaluate soft recovery benefits for noise-sensitive environments compared to standard fast recovery diodes.

Diode Arrays Part Context

This part belongs to the HiPerDynFRED series from IXYS, utilizing epitaxial diode technology. It is designed for high-efficiency power conversion where switching speed and thermal performance are critical. The ISOPLUS220 package offers a standardized footprint for industrial power modules. This specific variant focuses on balancing high current handling with ultra-fast recovery characteristics.

Diode Arrays Replacement Considerations

The datasheet explicitly recommends the DPG30P300PJ as the replacement part. Verify compatibility regarding pinout, thermal resistance, and electrical ratings before substitution.

Diode Arrays FAQ

What is the electrical isolation voltage of the DSEE29-06CC?

The device provides 2500 V~ electrical isolation between the cathode and the mounting tab at 50/60 Hz RMS.

What is the typical reverse recovery time (trr) for this diode?

The typical reverse recovery time is 30 ns, measured at IF = 1 A, -di/dt = 200 A/µs, and VR = 30 V.

How is the ISOPLUS220 package pinout configured?

Pin 1 is the Cathode, Pin 2 is Anode/Cathode, and Pin 3 is the Anode. The bottom heatsink (Pin 4) is electrically isolated from Pins 1, 2, and 3.